1A1R Diamond Cut-off Wheel
Bonding Type: Resin Bond, Metal Bond, & Vitrified Bond
Application: Cut-off, Slotting, Dicing, Slicing
Cutting Material: Tungsten Carbides, Glasses, Crystal, Ceramic, Aluminum Oxide, PCB, Magnetic materials, and etc.
Diameter(D): 2”, 3”,4”,5”,6”, 7”, 8”, 10”, 12”,14”, 16” (50mm to 400mm)
Thickness(T): 0.02” - 0.2” (0.5mm - 5mm)
Arbor Hole(H): Made to customer’s request.
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